• DocumentCode
    113596
  • Title

    The effect of geometric enhancement on the magnetic saw effect

  • Author

    Sitzman, Alex Joseph ; Stefani, Francis ; Bourell, David L.

  • fYear
    2014
  • fDate
    7-11 July 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper proposes that in some instances, the magnetic saw effect is purely a melt phenomena and describes a series of experiments where the magnetic saw effect was studied by varying the sub-millimeter radius of the enhancement point on a set of highly-controlled samples. The magnetic saw effect is an instability that can occur when high currents are required to make sharp bends, thereby greatly enhancing the magnetic field and current densities. These sharp bends generally occur at joints, cuts, or other flaws and can cause failure of high-current conductors. The magnetic saw effect has also been proposed as a possible metal-cutting mechanism for manufacturing purposes. Due to the very small length scales of the features associated with magnetic sawing, it is difficult to make samples that are controlled enough to get reproducible experimental results for systematic studies. In these experiments, printed circuit board technology was used to accurately make samples with very fine enhancement features. The conditions for the magnetic saw effect were modeled using an electromagnetic code to establish the important parameters that predict the onset of damage.
  • Keywords
    current density; cutting; magnetic field effects; printed circuit manufacture; sawing; current density; electromagnetic code; enhancement point; geometric enhancement effect; high-current conductors; magnetic field; magnetic saw effect; melt phenomena; metal-cutting mechanism; printed circuit board technology; sub-millimeter radius; Current density; Magnetic resonance imaging; Magnetomechanical effects; Materials; Numerical models; Sawing; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Launch Technology (EML), 2014 17th International Symposium on
  • Conference_Location
    La Jolla, CA
  • Type

    conf

  • DOI
    10.1109/EML.2014.6920191
  • Filename
    6920191