• DocumentCode
    113672
  • Title

    Implementation of power semiconductor aging behavior in an electric vehicle powertrain model

  • Author

    Ottl, Markus ; Schmitt, Timothy ; Schneider, R.

  • Author_Institution
    Res. Center for Mechatron., Univ. of Appl. Sci., Dornbirn, Austria
  • fYear
    2014
  • fDate
    9-11 Sept. 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Thermal stress in power semiconductor modules causes mechanical wear effects, which eventually lead to failure. A common approach to estimate the time to failure is to utilize power cycling tests. The results of these tests can not directly be transferred to real-life applications. In this paper, we propose a way to implement an on-line lifetime estimation in a dynamic electric vehicle simulation model. Results from power cycling tests are combined with simulation results of the application dependent temperature characteristics. They are processed using rainflow counting and Palmgren-Miners rule in order to calculate the progression of lifetime on-line. This information is fed back into the semiconductor simulation model.
  • Keywords
    electric vehicles; power semiconductor devices; power transmission (mechanical); thermal stresses; Palmgren-Miners rule; dynamic electric vehicle simulation model; electric vehicle powertrain model; mechanical wear effects; on-line lifetime estimation; power cycling tests; power semiconductor aging; power semiconductor modules; rainflow counting; semiconductor simulation model; thermal stress; Estimation; Junctions; Load modeling; Mathematical model; Semiconductor device modeling; Stress; Wires; IGBT; inverter; lifetime modelling; power semiconductors; reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Research and Education in Mechatronics (REM), 2014 15th International Workshop on
  • Conference_Location
    El Gouna
  • Type

    conf

  • DOI
    10.1109/REM.2014.6920232
  • Filename
    6920232