Title :
Impact of the LSI on High-Speed Computer Packaging
Author_Institution :
Department of Digital Computers, Central Research Laboratory
fDate :
4/1/1978 12:00:00 AM
Abstract :
The effect of the logic LSI on high-speed computer packaging and relevant problems are described from the standpoint of obtaining effective logic speed and packaging density in system environments.
Keywords :
Gate-pin relation; LSI; logic; packaging delay; packaging density; part-number; system delay; Application software; Delay effects; Delay systems; Guidelines; Large scale integration; Logic circuits; Logic design; Packaging; Pins; Power dissipation; Gate-pin relation; LSI; logic; packaging delay; packaging density; part-number; system delay;
Journal_Title :
Computers, IEEE Transactions on
DOI :
10.1109/TC.1978.1675104
