DocumentCode :
1137601
Title :
Foreword - Fifth international IEEE symposium on high density packaging and component failure analysis (HDP´02)
Author :
Johan Liu ; Xiaoming Xie
Author_Institution :
Chalmers University of Technology
Volume :
25
Issue :
4
fYear :
2002
Firstpage :
251
Lastpage :
252
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2002.807729
Filename :
1176905
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1137601
