DocumentCode

1137601

Title

Foreword - Fifth international IEEE symposium on high density packaging and component failure analysis (HDP´02)

Author

Johan Liu ; Xiaoming Xie

Author_Institution

Chalmers University of Technology

Volume

25

Issue

4

fYear

2002

Firstpage

251

Lastpage

252

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/TEPM.2002.807729

Filename

1176905