Title :
The absorption ink transfer mechanism of gravure offset printing for electronic circuitry
Author :
Pudas, Marko ; Hagberg, Juha ; Leppävuori, Seppo
Author_Institution :
Microelectron. Lab., Univ. of Oulu, Finland
fDate :
10/1/2002 12:00:00 AM
Abstract :
The gravure offset method has been developed toward an industrially viable printing technique for electronic circuitry. In order to obtain the optimum ink resin for printing lines of required thickness (>5 μm) of narrow lines (down to 25 μm), several ink resin systems have been assessed in previous studies by the authors. The best printed results were obtained with a novel ink using a hydrocarbon resin. This ink did not comply with the traditional ink transfer mechanism based on evaporation of the solvent, but with a postulated new "absorption mechanism.".
Keywords :
conducting materials; packaging; printing; viscosity; 5 to 25 micron; absorption ink transfer mechanism; absorption mechanism; electronic circuitry; gravure offset printing; hydrocarbon resin; industrially viable printing technique; optimum ink resin; Absorption; Circuits; Conductors; Graphics; Ink; Printing; Production; Resins; Solids; Solvents;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2002.807728