DocumentCode :
1138209
Title :
Examinations of Cu-Ag Composite Conductors in Sheet Forms
Author :
Davy, Charney A. ; Han, Ke ; Kalu, Peter N. ; Bole, Scott T.
Volume :
18
Issue :
2
fYear :
2008
fDate :
6/1/2008 12:00:00 AM
Firstpage :
560
Lastpage :
563
Abstract :
Cold rolled Cu-24 wt% Ag composite was characterized and the effects of crystallographic structure and defect anisotropy and microstructure refinement on properties of the composite were studied. Characterization was carried out with high resolution scanning electron microscopy (SEM), x-ray diffractometer and mechanical testing. All the deformed samples exhibited {110}-texture that had impact on the anisotropic properties of the materials. The yield and tensile strengths were higher in the long transverse (LT) than in the rolling direction (RD). The resistivity was higher in the RD than in the LT. Increasing the rolling strain increased both the mechanical strength and electric resistivity. The property changes with strain were related to the Cu and Ag lamellae thickness. The thickness of the lamella was inversely proportional to the deformation strain. It was observed that the smaller the thickness of the lamellae, the higher the strength and the electric resistivity. A closer examination of the Cu and Ag components revealed that while the lamellae were well aligned in the LT direction, they were curved in the RD. The curved lamellae observed in the RD were attributed to the development of shear bands during rolling. Both the texture and shear bands were related to the anisotropy of the properties.
Keywords :
cold rolling; composite materials; conductors (electric); sheet materials; Cu-Ag; X-ray diffractometer; anisotropy; cold rolling; composite conductors; crystallographic structure; curved lamellae; deformation strain; electric resistivity; mechanical strength; mechanical testing; scanning electron microscopy; shear bands; sheet form; tensile strength; Composites; high strength; lamellae; shear bands;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2008.922510
Filename :
4494467
Link To Document :
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