Pixel multichip module design for a high energy physics experiment

Author

Cardoso, G. ; Andresen, J. ; Appel, J.A. ; Christian, D.C. ; Hall, B.K. ; Kwan, S.W. ; Turqueti, M.A. ; Zimmermann, S.

Author_Institution

Fermi Nat. Accel. Lab., USA

Volume

51

Issue

5

fYear

2004

Firstpage

2168

Lastpage

2173

Abstract

At Fermilab, a pixel detector multichip module is being developed for the BTeV experiment. The module is composed of three layers. The lowest layer is formed by the readout integrated circuits (ICs). The back of the ICs is in thermal contact with the supporting structure, while the top is flip-chip bump-bonded to the pixel sensor. A low mass flex-circuit interconnect is glued on the top of this assembly, and the readout IC pads are wire-bounded to the circuit. This paper presents recent results on the development of a multichip module prototype and summarizes its performance characteristics.

Keywords

integrated circuit interconnections; lead bonding; meson detection; multichip modules; readout electronics; semiconductor counters; BTeV experiment; Fermilab; bump-bonding; flip-chip; high density interconnects; high density packaging; high energy physics experiment; low mass flex-circuit interconnect; multichip module prototype; particle detectors; performance characteristics; pixel detectors; pixel multichip module design; pixel sensor; readout IC pads; readout integrated circuits; supporting structure; thermal contact; wire binding; Assembly; Detectors; Laboratories; Magnetic fields; Multichip modules; Packaging; Physics; Sensor arrays; Sensor phenomena and characterization; Thermal sensors; High density inerconnects; high density packaging; particle detectors; pixel detectors;

fLanguage

English

Journal_Title

Nuclear Science, IEEE Transactions on

Publisher

ieee

ISSN

0018-9499

Type

jour

DOI

10.1109/TNS.2004.836059

Filename

1344303