Title :
Utilizing a low cost 3D packaging technology for consumer applications
Author :
Larcombe, Steven P. ; Stern, John M. ; Ivey, Peter A. ; Seed, Luke
Author_Institution :
Dept. of Electron. & Electr. Eng., Sheffield Univ., UK
fDate :
11/1/1995 12:00:00 AM
Abstract :
This paper demonstrates how a low cost three-dimensional packaging (multichip module-vertical) technology can be utilized to implement systems for consumer applications. In any application where system cost, volume and mass are important, this packaging technique can be advantageous, particularly in the rapidly growing portable electronics industry. To illustrate this we present a general-purpose, low-cost camera and image processing system in the new packaging technology. This can be used in multimedia, surveillance and smart vision applications
Keywords :
consumer electronics; image processing; intelligent sensors; multichip modules; multimedia systems; surveillance; video cameras; consumer applications; image processing system; low cost 3D packaging technology; low-cost camera; mass; multichip module-vertical; multimedia applications; portable electronics industry; portable video communicator; smart vision applications; surveillance applications; system cost; volume; Actuators; Consumer electronics; Costs; Electronics industry; Electronics packaging; Fabrication; Intelligent sensors; Power dissipation; Signal processing; Transducers;
Journal_Title :
Consumer Electronics, IEEE Transactions on
