DocumentCode :
1139010
Title :
First experimental tests with a CdTe photon counting pixel detector hybridized with a Medipix2 readout chip
Author :
Chmeissani, M. ; Frojdh, C. ; Gal, O. ; Llopart, X. ; Ludwig, J. ; Maiorino, M. ; Manach, E. ; Mettivier, G. ; Montesi, M.C. ; Ponchut, C. ; Russo, P. ; Tlustos, L. ; Zwerger, A.
Author_Institution :
Inst. de Fisica d´´Altes Energies, Barcelona, Spain
Volume :
51
Issue :
5
fYear :
2004
Firstpage :
2379
Lastpage :
2385
Abstract :
We present preliminary tests of hybrid pixel detectors consisting of the Medipix2 readout chip bump-bonded to a 1-mm-thick CdTe pixel detector. This room temperature imaging system for single photon counting has been developed within the Medipix2 European Collaboration for various imaging applications with X-rays and gamma rays, including dental radiography, mammography, synchrotron radiation, nuclear medicine, and radiation monitoring in nuclear facilities. The Medipix2 + CdTe hybrid detector features 256 × 256 square pixels, a pitch of 55 μm, a sensitive area of 14×14 mm2. We analyzed the quality of the detector and bump-bonding and the response to nuclear radiation of the first CdTe hybrids. The CdTe pixel detectors, with Pt ohmic contacts, showed an ohmic response when negatively biased up to less than 60 V (electrons collection mode). Tests were also performed in holes collection mode, where a nonresistive behavior was observed above +15 V. We performed a series of imaging tests at low voltage bias with gamma radioactive sources and with an X-ray tube. Under uniform irradiation, we observed for all detectors the presence of numerous, stable structures in the form of small circles of about 200 μm diameter, with the central pixels showing a reduced counting efficiency with respect to the periphery (in electrons counting regime). Also long filament structures have been observed. Further investigations will reveal whether they are due to an intrinsic detector response (e.g., due to Te inclusions) or to the bump-bonding process.
Keywords :
X-ray effects; X-ray imaging; X-ray tubes; biomedical imaging; bonding processes; dentistry; diagnostic radiography; gamma-ray detection; gamma-ray effects; mammography; nuclear electronics; ohmic contacts; photon counting; position sensitive particle detectors; radiation monitoring; radioactive sources; readout electronics; semiconductor counters; synchrotron radiation; 1 mm; 14 mm; 256 pixel; 293 to 298 K; 65536 pixel; CdTe photon counting pixel detector; Medipix2 European Collaboration; Medipix2 readout chip; Medipix2+CdTe hybrid detector; Pt ohmic contacts; Te inclusions; X-ray imaging; X-ray tube; bump-bonding process; central pixels; counting efficiency; dental radiography; detector quality; electron collection mode; electron counting regime; gamma radioactive sources; gamma ray imaging; hole collection mode; imaging tests; intrinsic detector response; long filament structures; low voltage bias; mammography; negative bias voltage; nonresistive behavior; nuclear facilities; nuclear medicine; nuclear radiation; ohmic response; pixel pitch; radiation monitoring; room temperature imaging system; sensitive area; single photon counting; stable small circular structure; synchrotron radiation; uniform irradiation; Collaboration; Dentistry; Detectors; Electrons; Gamma rays; Optical imaging; Performance evaluation; Temperature; Testing; X-rays; CdTe; Medipix2; hybrid detectors;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2004.832324
Filename :
1344341
Link To Document :
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