DocumentCode :
1139145
Title :
A new criterion for transient latchup analysis in bulk CMOS
Author :
Yang, Yeu-Haw ; Wu, Chung-Yu
Author_Institution :
Inst. of Electron., Nat. Chiao Tung Univ., Hsin-Chu, Taiwan
Volume :
36
Issue :
7
fYear :
1989
fDate :
7/1/1989 12:00:00 AM
Firstpage :
1336
Lastpage :
1347
Abstract :
A criterion for transient latchup of p-n-p-n structures initiated by current pulses is described. Based on the circuit-orient model, the terminal currents and voltages of the transistors as a function of the pulsed triggering currents are characterized, and the charge storage within p-n-p-n structures is investigated. It is found that, to maintain the regeneration process, the change of charge stored in junction depletion capacitances of a p-n-p-n structure must be greater than a certain value independent of the triggering currents. Thus, the criterion is constructed in terms of the constant charge storage within a p-n-p-n structure. Applying the criterion, latchup immunity against pulsed triggering currents can be evaluated with respect to process and device parameters. Both SPICE simulations and experimental results confirm the validity of the proposed transient criterion. It is found that the large transit time of bipolar transistors and large well-substrate junction depletion capacitance lead to higher latchup immunity against pulsed triggering currents
Keywords :
CMOS integrated circuits; digital simulation; semiconductor device models; SPICE simulations; bulk CMOS; circuit-orient model; constant charge storage; current pulses; junction depletion capacitances; p-n-p-n structures; pulsed triggering currents; regeneration process; terminal currents; transient latchup analysis; transit time; Analytical models; Bipolar transistors; Capacitance; Computational modeling; P-n junctions; SPICE; Semiconductor device modeling; Space vector pulse width modulation; Transient analysis; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.30939
Filename :
30939
Link To Document :
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