Title :
Uncertainty in multiple penetration depth fringing electric field sensor measurements
Author :
Mamishev, A.V. ; Cantrell, S.R. ; Du, Y. ; Lesieutre, B.C. ; Zahn, M.
Author_Institution :
Dept. of Electr. Eng., Univ. of Washington, Seattle, WA, USA
fDate :
12/1/2002 12:00:00 AM
Abstract :
Measurement of multilayer material properties with fringing electric field dielectrometry sensors requires the processing of terminal admittance data from multiple electrode pairs. The choice of the algorithmic approach for data analysis is critical because of a high sensitivity to small measurement uncertainties. While individual channel uncertainties are usually within a reasonable instrumentation range, measurement of properties of multiple material layers fails unless special techniques are used to prevent numerical instabilities. This paper demonstrates the mechanism of uncertainty in a successive stair-step property estimation in which the estimates of one layer´s properties are used to estimate the subsequent layer´s properties. Three-wavelength measurements of dielectric permittivity and conductivity illustrate the problem in two-layer experimental setups. Limitations of the stair-step approach and possible future improvements are discussed.
Keywords :
electric admittance measurement; electric field measurement; electric sensing devices; electrical conductivity measurement; interdigital transducers; measurement uncertainty; permittivity measurement; data processing algorithm; dielectric permittivity; electrical admittance; electrical conductivity; measurement uncertainty; multilayer material; multiple penetration depth fringing electric field sensor; numerical instability; stair-step estimation; three-wavelength interdigital dielectrometry instrumentation; Admittance measurement; Data analysis; Dielectric measurements; Electric variables measurement; Electrodes; Material properties; Measurement uncertainty; Mechanical factors; Nonhomogeneous media; Permittivity measurement;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
DOI :
10.1109/TIM.2002.808013