Title :
An experimental study of single-event effects induced in commercial SRAMs by neutrons and protons from thermal energies to 500 MeV
Author :
Dyer, C.S. ; Clucas, S.N. ; Sanderson, C. ; Frydland, A.D. ; Green, R.T.
Author_Institution :
Space Dept., QinetiQ, Farnborough, UK
Abstract :
Irradiations have been performed, with neutrons and protons over a wide particle energy range, on six different commercial-grade 4-Mbit SRAM parts from the manufacturers Hitachi, Toshiba, Mitsubishi, and Samsung. At energies above 20 MeV, the single-event upset (SEU) cross sections are similar for protons and neutrons. While the proton cross sections fall off rapidly below this energy due to package shielding and Coulomb barrier effects, the neutron cross sections at 14.5 MeV are close to the high energy plateau values. Four of the devices show significant thermal neutron SEU cross sections and in two cases these exceed the high energy plateau values. The most modern of the parts tested is susceptible to latchup from both protons and neutrons but the response is shifted to higher energies compared with SEU.
Keywords :
SRAM chips; neutron effects; proton effects; semiconductor device packaging; semiconductor device testing; shielding; thermal management (packaging); BPSG; Coulomb barrier effects; Hitachi; Mitsubishi; SEU; Samsung; Toshiba; atmospheric neutrons; commercial technologies; commercial-grade 4-Mbit SRAM parts; high energy plateau values; neutron irradiation; neutron radiation effects; package shielding; proton irradiation; proton radiation effects; semiconductor device testing; single-event effects; single-event upset cross sections; thermal energies; thermal neutrons; Aircraft; Atomic layer deposition; Cosmic rays; Magnetic fields; Neutrons; Protons; Random access memory; Single event upset; Space shuttles; Space technology; Atmospheric neutrons; BPSG; SEEs; SRAM; commercial technologies; neutron radiation effects; proton radiation effects; semiconductor device testing; single-event effects; thermal neutrons;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2004.835083