Title :
High transmission gain integrated antenna on extremely high resistivity Si for ULSI wireless interconnect
Author :
Rashid, A.B.M.H. ; Watanabe, S. ; Kikkawa, T.
Author_Institution :
Res. Center for Nanodevices & Syst., Hiroshima Univ., Japan
Abstract :
We have demonstrated the highest transmission gain integrated dipole antenna on Si reported so far, to use as an integrated antenna for the purpose of ULSI on-chip wireless interconnection. A 2-mm long and 10-μm wide dipole antenna pair at a distance of 1 cm shows a transmission gain of -36.5 dB at 18 GHz, which is 20 dB higher than the previously reported gain. This large increase in gain is achieved by proton implantation on the Si substrate, which increased the resistivity from 10 /spl Omega/-cm to 0.1 M/spl Omega/-cm. It is also found that transmission gain can be maximized for a given resistivity by optimizing the Si substrate thickness or by inserting a low-k dielectric layer below the substrate.
Keywords :
ULSI; dipole antennas; electrical resistivity; integrated circuit interconnections; ion implantation; -36.5 dB; 10 micron; 10 ohmcm to 0.1 Mohmcm; 18 GHz; 2 mm; Si; Si substrate; Si substrate thickness optimization; ULSI on-chip wireless interconnection; ULSI wireless interconnect; dipole antenna pair; extremely high resistivity Si; high transmission gain integrated dipole antenna; low-k dielectric layer; proton implantation; transmission gain; Aluminum; Clocks; Conducting materials; Conductivity; Dielectric substrates; Dipole antennas; Integrated circuit interconnections; Protons; Transmitting antennas; Ultra large scale integration;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2002.805754