Title :
A High Density Programmable Logic Array Chip
Author_Institution :
IBM Corporation, System Communications Division
Abstract :
A programmable logic array (PLA) chip design using special array folding techniques and an on-chip bus structure has been developed. It overcomes the sparseness in conventional large PLA configurations. The design is a masterslice FET chip personalized for the particular application during processing. Software algorithms are used to map conventional PLA formats into the new structure. The techniques used provide improved logic function and performance for an FET array technology. Included are descriptions of the PLA architecture and the circuitry that was used.
Keywords :
Array folding techniques; array logic; array optimization; folded array configuration; programmable logic array (PLA); Application software; Chip scale packaging; Circuits; Computer architecture; FETs; Logic arrays; Logic design; Logic functions; Programmable logic arrays; Software algorithms; Array folding techniques; array logic; array optimization; folded array configuration; programmable logic array (PLA);
Journal_Title :
Computers, IEEE Transactions on
DOI :
10.1109/TC.1979.1675427
