Title :
Experimental evidence of TBD power-law for voltage dependence of oxide breakdown in ultrathin gate oxides
Author :
Wu, Ernest Y. ; Vayshenker, A. ; Nowak, E. ; Sune, J. ; Vollertsen, R.-P. ; Lai, W. ; Harmon, D.
Author_Institution :
IBM Microelectron. Div., Essex Junction, VT, USA
fDate :
12/1/2002 12:00:00 AM
Abstract :
In this paper, we present experimental evidence on the voltage-dependence of the voltage acceleration factors observed on ultrathin oxides from 5 nm down to ∼1 nm over a wide range of voltages from ∼2 V to 6 V. Two independent experimental approaches, area scaling method and long-term stress, are used to investigate this phenomenon. We show the exponential law with a constant voltage-acceleration factor violates the widely accepted fundamental breakdown property of Poisson random statistics while the voltage-dependent voltage acceleration described by an empirical power-law relation preserves this well-known property. The apparent thickness-dependence of voltage acceleration factors measured in different voltage ranges can be nicely understood and unified with these independent experimental results in the scenario of a voltage-driven breakdown. In the framework of the critical defect density and defect generation rate for charge-to-breakdown, we explore the possible explanation of increasing voltage acceleration factors at reduced voltage by assuming a geometric model for the critical defect density.
Keywords :
MIS devices; dielectric thin films; semiconductor device breakdown; semiconductor device measurement; semiconductor device reliability; statistical analysis; 1 to 5 nm; 2 to 6 V; MOS devices; Poisson random statistics; TBD power-law; TDDB measurements; area scaling method; breakdown property; charge-to-breakdown; constant voltage-acceleration factor; critical defect density; defect generation rate; empirical power-law relation; exponential law; gate dielectric; geometric model; long-term stress; oxide breakdown; oxide reliability; semiconductor device reliability; thickness-dependence; time-dependent dielectric breakdown; ultrathin gate oxides; voltage acceleration factors; voltage dependence; voltage-dependent voltage acceleration; voltage-driven breakdown; Acceleration; Associate members; Breakdown voltage; CMOS technology; Dielectrics; Electric breakdown; Hydrogen; Microelectronics; Semiconductor device reliability; Stress;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2002.805606