Title :
Convergence of Transverse Waveform Relaxation for the Electrical Analysis of Very Wide Transmission Line Buses
Author :
Elfadel, Ibrahim M.
Author_Institution :
IBM Corp., Yorktown Heights, NY, USA
Abstract :
In this paper, we study the convergence and approximation error of the transverse waveform relaxation (TWR) method for the analysis of very wide on-chip multiconductor transmission line systems. Significant notational simplicity is achieved in the analysis using a splitting framework for the per-unit-length matrix parameters of the transmission lines. This splitting enables us to show that the state-transition matrix of the coupled lines satisfies a linear Volterra integral equation of the second kind, whose solution is generated by the TWR method as a summable series of iterated kernels with decreasing norms. The upper bounds on these norms are proved to be O(k r/r !), where r is the number of iterations and k is a measure of the electromagnetic couplings between the lines. Very fast convergence is guaranteed in the case of weak coupling (k Lt 1). These favorable convergence properties are illustrated using a test suite of industrial very large scale integration global buses in a modern 65-nm CMOS process, where it is shown that few ( ap 3) Gauss-Jacobi iterations are sufficient for convergence to the exact solution.
Keywords :
approximation theory; convergence of numerical methods; iterative methods; matrix algebra; multiconductor transmission lines; waveform analysis; CMOS process; Gauss-Jacobi iterations; approximation error; convergence; electrical analysis; electromagnetic couplings; iterated kernels; linear Volterra integral equation; on-chip multiconductor transmission line systems; per-unit-length matrix parameters; size 65 nm; splitting framework; transmission line buses; transverse waveform relaxation; transverse waveform relaxation method; Circuit simulation; coupled transmission lines; on-chip buses; very large scale integration (VLSI); waveform relaxation (WR);
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
DOI :
10.1109/TCAD.2009.2021729