The Proof is in the Nanopacking

Nanotechnologies are becoming ubiquitous as they spawn new products and are incorporated as enhancements of the familiar, so it should come as no surprise that nanotechnologies are being vigorously researched for applications in microelectronics packaging. High CNT thermal conductivity may be exploited for chip cooling in conductive and convective cooling systems. CNT alignment is critical for conductive systems, since the conductivities of random CNT arrays show no advantage over conventional materials. Packaging issues with nanoelectronics technologies are exacerbated by the scales of decreasing interconnect dimensions, increasing current densities, and especially increasing power dissipation.