• DocumentCode
    1144023
  • Title

    Foreword contributions from thermal investigations of ICs and systems (THERMINIC)

  • Author

    Lasance, C.J.M. ; Rencz, Marta

  • Author_Institution
    Philips Research Laboratories
  • Volume
    25
  • Issue
    4
  • fYear
    2002
  • Firstpage
    531
  • Lastpage
    532
  • Keywords
    Components, packaging, and manufacturing technology; Conferences; Electrical resistance measurement; Electronic packaging thermal management; Laboratories; Microelectronics; Paper technology; Testing; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2003.809114
  • Filename
    1178740
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1144023