Title :
Foreword contributions from thermal investigations of ICs and systems (THERMINIC)
Author :
Lasance, C.J.M. ; Rencz, Marta
Author_Institution :
Philips Research Laboratories
Keywords :
Components, packaging, and manufacturing technology; Conferences; Electrical resistance measurement; Electronic packaging thermal management; Laboratories; Microelectronics; Paper technology; Testing; Thermal management; Thermal resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2003.809114
