• DocumentCode
    1144031
  • Title

    Enhanced electronic system reliability - challenges for temperature prediction

  • Author

    Parry, John D. ; Rantala, Jukka ; Lasance, Clemens J M

  • Volume
    25
  • Issue
    4
  • fYear
    2002
  • fDate
    12/1/2002 12:00:00 AM
  • Firstpage
    533
  • Lastpage
    538
  • Abstract
    Using telecommunication as an example, it is argued that the electronics industry badly needs a change in attitude toward reliability thinking. The role of thermal design and reliability qualification is discussed in context of current industrial needs for short design cycles and rapid implementation of new technologies. Current and future practices are discussed in the context of newly-emerging reliability standards. Finally, two multi-company projects targeting the improvement of reliability through better temperature-related information are described.
  • Keywords
    design engineering; electronics industry; reliability; standards; electronic system reliability; electronics industry; multi-company projects; reliability qualification; reliability standards; short design cycles; temperature prediction; thermal design; Associate members; Circuit testing; Computer industry; Costs; Electronics industry; Laboratories; Mobile handsets; Qualifications; Telecommunication network reliability; Temperature;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2002.808001
  • Filename
    1178741