DocumentCode
1144031
Title
Enhanced electronic system reliability - challenges for temperature prediction
Author
Parry, John D. ; Rantala, Jukka ; Lasance, Clemens J M
Volume
25
Issue
4
fYear
2002
fDate
12/1/2002 12:00:00 AM
Firstpage
533
Lastpage
538
Abstract
Using telecommunication as an example, it is argued that the electronics industry badly needs a change in attitude toward reliability thinking. The role of thermal design and reliability qualification is discussed in context of current industrial needs for short design cycles and rapid implementation of new technologies. Current and future practices are discussed in the context of newly-emerging reliability standards. Finally, two multi-company projects targeting the improvement of reliability through better temperature-related information are described.
Keywords
design engineering; electronics industry; reliability; standards; electronic system reliability; electronics industry; multi-company projects; reliability qualification; reliability standards; short design cycles; temperature prediction; thermal design; Associate members; Circuit testing; Computer industry; Costs; Electronics industry; Laboratories; Mobile handsets; Qualifications; Telecommunication network reliability; Temperature;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2002.808001
Filename
1178741
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