• DocumentCode
    1144090
  • Title

    Foreword contributions from thermal challenges in next generation electronic systems (THERMES)

  • Author

    Garimella, Suresh V. ; Joshi, Yogendra K.

  • Author_Institution
    Purdue University
  • Volume
    25
  • Issue
    4
  • fYear
    2002
  • Firstpage
    567
  • Lastpage
    568
  • Keywords
    Consumer electronics; Electronic packaging thermal management; Electronics cooling; Heat transfer; Mechanical engineering; Product development; Resource management; Thermal loading; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2002.807992
  • Filename
    1178746
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1144090