DocumentCode
1144142
Title
Design and optimization of air-cooled heat sinks for sustainable development
Author
Bar-Cohen, Avram ; Iyengar, Madhusudan
Author_Institution
Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA
Volume
25
Issue
4
fYear
2002
fDate
12/1/2002 12:00:00 AM
Firstpage
584
Lastpage
591
Abstract
The development of heat sinks for microelectronic applications, which are compatible with sustainable development, involves the achievement of a subtle balance between a superior thermal design, minimum material consumption, and minimum pumping power. Due to the rapid proliferation of electronic systems, substantial material streams and energy consumption rates are associated with the cooling of computers, as well as other categories of electronic equipment. This presentation explores the potential for the least-energy optimization of natural- and forced-convection cooled rectangular plate heat sinks. The results are evaluated in terms of a heat sink coefficient of performance, relating the cooling capability to the energy invested. Guidelines for "sustainable" heat sink designs are suggested.
Keywords
cooling; forced convection; heat sinks; integrated circuit packaging; natural convection; optimisation; air-cooled heat sinks; coefficient of performance; energy consumption rates; forced-convection cooling; least-energy optimization; material consumption; microelectronic applications; natural-convection cooling; pumping power; rectangular plate heat sinks; sustainable development; thermal design; Application software; Design optimization; Electronic equipment; Electronics cooling; Energy consumption; Guidelines; Heat pumps; Heat sinks; Microelectronics; Sustainable development;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2003.809112
Filename
1178751
Link To Document