Title :
Investigation of plasma evolution in a coaxial small-gap magnetically insulated transmission line
Author :
Ivanov, V.V. ; Laca, P.J. ; Bauer, B.S. ; Presura, R. ; Sotnikov, V.I. ; Astanovitskiy, A.L. ; Le Galloudec, B. ; Glassman, J. ; Wirtz, R.A.
Author_Institution :
Dept. of Phys., Univ. of Nevada, Reno, NV, USA
Abstract :
Interferometry and two-frame schlieren imaging were used to study arc discharge evolution in a small-gap, coaxial, magnetically insulated transmission line driven by a 2-TW generator with a current pulse rise time of 70 ns. Two kinds of plasma objects were observed in experiments: plasma of arc discharges and low-density peripheral plasma. Plasma fills most of the magnetically insulated transmission line (MITL) gap in the area of the arc and produces a stripe trace of evaporated metal on the surface of electrodes. Arc discharge typically arises near the cathode. Anode plasma arises in the later stage, after which, the plasma fills the gap. A scenario of plasma evolution of the arc discharge is discussed. Low-density plasma is located in thin layers near the cathode or the anode. It plays a role in the seeding of arc discharges that grow before the closure of the gap and dissipates after the closure.
Keywords :
Mach-Zehnder interferometers; anodes; cathodes; plasma density; plasma diagnostics; plasma production; power transmission lines; schlieren systems; transmission lines; vacuum arcs; 2 TW; 70 ns; anode plasma; arc discharge seeding; cathode; coaxial transmission line; current pulse rise time; electrode surface; interferometry; low-density peripheral plasma; magnetically insulated transmission line; plasma evolution; power generator; small-gap transmission line; stripe trace; two-frame schlieren imaging; Anodes; Arc discharges; Cathodes; Coaxial components; Insulation; Interferometry; Plasmas; Pulse generation; Surface discharges; Transmission lines; Interferometry; magnetically insulated transmission lines; schlieren diagnostic; vacuum arc discharge;
Journal_Title :
Plasma Science, IEEE Transactions on
DOI :
10.1109/TPS.2004.835491