DocumentCode
1144163
Title
Dynamics and topology optimization of piezoelectric fans
Author
Bürmann, Philipp ; Raman, Arvind ; Garimella, Suresh V.
Author_Institution
Dept. of Solid Mech., Tech. Univ. Dresden, Germany
Volume
25
Issue
4
fYear
2002
fDate
12/1/2002 12:00:00 AM
Firstpage
592
Lastpage
600
Abstract
Piezoelectric fans are very low power, small, very low noise, solid-state devices that have recently emerged as viable thermal management solutions for a variety of portable electronics applications including laptop computers, cellular phones and wearable computers. Piezoelectric fans utilize piezoceramic patches bonded onto thin, low frequency flexible blades to drive the fan at its resonance frequency. The resonating, low frequency blade creates a streaming airflow directed at key electronics components. The optimization of a piezoelectric fan with two symmetrically placed piezoelectric patches is investigated through an analytical Bernoulli-Euler model as well as a finite element (FE) model of the composite piezo-beam. The closed form analytical solution is used to demonstrate that different optimal piezoceramic-to-blade length ratios and piezoceramic-to-blade thickness ratios exist for maximizing the electromechanical coupling factor (EMCF), tip deflection and rotation. Such optimization procedures provide simple design guidelines for the development of very-low power, high flow rate piezoelectric fans.
Keywords
cooling; finite element analysis; piezoelectric devices; thermal management (packaging); Bernoulli-Euler model; electromechanical coupling factor; finite element model; flow rate; low frequency flexible blades; noise; piezoceramic patches; piezoceramic-to-blade length ratios; piezoceramic-to-blade thickness ratios; piezoelectric fans; portable electronics applications; resonance frequency; streaming airflow; symmetrically placed piezoelectric patches; thermal management solutions; tip deflection; topology optimization; Blades; Circuit topology; Fans; Low-frequency noise; Piezoelectric devices; Portable computers; Resonant frequency; Solid state circuits; Thermal management of electronics; Wearable computers;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2003.809111
Filename
1178753
Link To Document