DocumentCode :
1144163
Title :
Dynamics and topology optimization of piezoelectric fans
Author :
Bürmann, Philipp ; Raman, Arvind ; Garimella, Suresh V.
Author_Institution :
Dept. of Solid Mech., Tech. Univ. Dresden, Germany
Volume :
25
Issue :
4
fYear :
2002
fDate :
12/1/2002 12:00:00 AM
Firstpage :
592
Lastpage :
600
Abstract :
Piezoelectric fans are very low power, small, very low noise, solid-state devices that have recently emerged as viable thermal management solutions for a variety of portable electronics applications including laptop computers, cellular phones and wearable computers. Piezoelectric fans utilize piezoceramic patches bonded onto thin, low frequency flexible blades to drive the fan at its resonance frequency. The resonating, low frequency blade creates a streaming airflow directed at key electronics components. The optimization of a piezoelectric fan with two symmetrically placed piezoelectric patches is investigated through an analytical Bernoulli-Euler model as well as a finite element (FE) model of the composite piezo-beam. The closed form analytical solution is used to demonstrate that different optimal piezoceramic-to-blade length ratios and piezoceramic-to-blade thickness ratios exist for maximizing the electromechanical coupling factor (EMCF), tip deflection and rotation. Such optimization procedures provide simple design guidelines for the development of very-low power, high flow rate piezoelectric fans.
Keywords :
cooling; finite element analysis; piezoelectric devices; thermal management (packaging); Bernoulli-Euler model; electromechanical coupling factor; finite element model; flow rate; low frequency flexible blades; noise; piezoceramic patches; piezoceramic-to-blade length ratios; piezoceramic-to-blade thickness ratios; piezoelectric fans; portable electronics applications; resonance frequency; streaming airflow; symmetrically placed piezoelectric patches; thermal management solutions; tip deflection; topology optimization; Blades; Circuit topology; Fans; Low-frequency noise; Piezoelectric devices; Portable computers; Resonant frequency; Solid state circuits; Thermal management of electronics; Wearable computers;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2003.809111
Filename :
1178753
Link To Document :
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