Title :
In-plane effective thermal conductivity of plain-weave screen laminates
Author :
Xu, Jun ; Wirtz, Richard A.
Author_Institution :
Mech. Eng. Dept., Univ. of Nevada, Reno, NV, USA
fDate :
12/1/2002 12:00:00 AM
Abstract :
A simple-to-fabricate woven mesh, consisting of bonded laminates of two-dimensional plain-weave conductive screens is described. Geometric equations show that these porous matrices can be fabricated to have a wide range of porosity and specific surface area, β. A heat transfer model is developed. It shows that the laminates can have a highly anisotropic thermal conductivity vector, with in-plane effective thermal conductivities ranging up to 78.5% of base material values. A technique to measure the laminate in-plane effective thermal diffusivity is described. Measurements of the in-plane effective thermal diffusivity of copper plain-weave laminates are used to benchmark the model.
Keywords :
heat transfer; laminates; porosity; porous materials; thermal analysis; thermal conductivity; thermal diffusivity; thermal management (packaging); thermal resistance; 2D plain-weave conductive screens; bonded laminates; geometric equations; heat transfer model; highly anisotropic thermal conductivity vector; in-plane effective thermal conductivity; in-plane effective thermal diffusivity; plain-weave screen laminates; porosity; porous matrices; specific surface area; woven mesh; Aluminum; Anisotropic magnetoresistance; Bonding; Conducting materials; Equations; Laminates; Mechanical engineering; Thermal conductivity; Thermal resistance; Wire;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2002.807993