• DocumentCode
    1144218
  • Title

    In-plane effective thermal conductivity of plain-weave screen laminates

  • Author

    Xu, Jun ; Wirtz, Richard A.

  • Author_Institution
    Mech. Eng. Dept., Univ. of Nevada, Reno, NV, USA
  • Volume
    25
  • Issue
    4
  • fYear
    2002
  • fDate
    12/1/2002 12:00:00 AM
  • Firstpage
    615
  • Lastpage
    620
  • Abstract
    A simple-to-fabricate woven mesh, consisting of bonded laminates of two-dimensional plain-weave conductive screens is described. Geometric equations show that these porous matrices can be fabricated to have a wide range of porosity and specific surface area, β. A heat transfer model is developed. It shows that the laminates can have a highly anisotropic thermal conductivity vector, with in-plane effective thermal conductivities ranging up to 78.5% of base material values. A technique to measure the laminate in-plane effective thermal diffusivity is described. Measurements of the in-plane effective thermal diffusivity of copper plain-weave laminates are used to benchmark the model.
  • Keywords
    heat transfer; laminates; porosity; porous materials; thermal analysis; thermal conductivity; thermal diffusivity; thermal management (packaging); thermal resistance; 2D plain-weave conductive screens; bonded laminates; geometric equations; heat transfer model; highly anisotropic thermal conductivity vector; in-plane effective thermal conductivity; in-plane effective thermal diffusivity; plain-weave screen laminates; porosity; porous matrices; specific surface area; woven mesh; Aluminum; Anisotropic magnetoresistance; Bonding; Conducting materials; Equations; Laminates; Mechanical engineering; Thermal conductivity; Thermal resistance; Wire;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2002.807993
  • Filename
    1178758