Title :
Advanced thermal architecture for cooling of high power electronics
Author :
Zuo, Zhijun ; Hoover, L.R. ; Phillips, A.L.
Author_Institution :
Thermacore Int. Inc., Lancaster, PA, USA
fDate :
12/1/2002 12:00:00 AM
Abstract :
This paper presents a thermal architecture concept for analysis of thermal problems and solutions existing in electronics systems. The thermal problems are categorized into a total of seven levels from chip to system. Advanced thermal technologies for addressing the thermal problems at all seven levels are discussed. Integrating the thermal architecture with the electronic architecture can significantly improve the effectiveness of the thermal management.
Keywords :
cooling; thermal analysis; thermal management (packaging); advanced thermal architecture; electronics cooling; high power electronics; Computer architecture; Electronic packaging thermal management; Electronics cooling; Integrated circuit interconnections; Microprocessors; Power system reliability; Refrigeration; Temperature; Thermal management; Thermal management of electronics;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2002.807995
