Title :
Spectral K-way ratio-cut partitioning and clustering
Author :
Chan, Pak K. ; Schlag, Martine D F ; Zien, Jason Y.
Author_Institution :
Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
fDate :
9/1/1994 12:00:00 AM
Abstract :
Recent research on partitioning has focused on the ratio-cut cost metric, which maintains a balance between the cost of the edges cut and the sizes of the partitions without fixing the size of the partitions a priori. Iterative approaches and spectral approaches to two-way ratio-cut partitioning have yielded higher quality partitioning results. In this paper, we develop a spectral approach to multi-way ratio-cut partitioning that provides a generalization of the ratio-cut cost metric to L-way partitioning and a lower bound on this cost metric. Our approach involves finding the k smallest eigenvalue/eigenvector pairs of the Laplacian of the graph. The eigenvectors provide an embedding of the graph´s n vertices into a k-dimensional subspace. We devise a time and space efficient clustering heuristic to coerce the points in the embedding into k partitions. Advancement over the current work is evidenced by the results of experiments on the standard benchmarks
Keywords :
circuit layout CAD; eigenvalues and eigenfunctions; graph theory; spectral-domain analysis; Laplacian; circuit layout; clustering heuristic; design automation; graph partitioning; k smallest eigenvalue/eigenvector pairs; k-dimensional subspace; multi-way ratio-cut partitioning; ratio-cut cost metric; spectral approach; standard benchmarks; Costs; Design automation; Eigenvalues and eigenfunctions; Integrated circuit interconnections; Iterative methods; LAN interconnection; Laplace equations; Packaging; Partitioning algorithms; Space exploration;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on