Thermal characterization of vertical multichip modules MCM-V

Author

Cahill, Ciaran ; Compagno, Anthony ; Donovan, John O. ; Slattery, Orla ; Mathuna, Séan Cian ó ; Barrett, John ; Serthelon, Isabel ; Val, Christian ; Tigners, J.-P. ; Stern, Jon ; Ivey, Peter ; Masgrangeas, Marc ; Coello-Vera, Augustin

Author_Institution

Nat. Microelectron. Res. Centre, Cork, Ireland

Volume

18

Issue

4

fYear

1995

fDate

12/1/1995 12:00:00 AM

Firstpage

765

Lastpage

772

Abstract

This paper describes the thermal characterization of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of IC´s in a three dimensional cube of plastic molding compound, with the inter-chip electrical connections made on the outside faces of the tube. Thermal measurements mere carried out on two different sized modules containing eight specially designed package evaluation test chips. Steady state and transient thermal results are presented. Simulation results are shown for two applications manufactured using the MCM-V technology; a 2 W, 16 chip 256 MBit DRAM module and a 3 W: 9 chip image processing system

Keywords

multichip modules; plastic packaging; thermal analysis; transient analysis; 2 W; 3 W; DRAM module; MCM-V; image processing system; inter-chip electrical connections; package evaluation test chips; plastic molding compound; steady state results; thermal characterization; three dimensional cube; transient thermal results; vertical multichip modules; Image processing; Manufacturing processes; Multichip modules; Packaging; Plastics; Semiconductor device measurement; Size measurement; Steady-state; Testing; Virtual manufacturing;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.477462

Filename

477462