• DocumentCode
    1145090
  • Title

    Experimental investigation of subcooled liquid nitrogen impingement cooling of a silicon chip

  • Author

    Vader, David T. ; Chrysler, Gregory M. ; Chu, Richard C. ; Simons, Robert E.

  • Author_Institution
    Dept. of Eng., Messiah Coll., Grantham, PA, USA
  • Volume
    18
  • Issue
    4
  • fYear
    1995
  • fDate
    12/1/1995 12:00:00 AM
  • Firstpage
    788
  • Lastpage
    794
  • Abstract
    A technique was developed to facilitate subcooled pool boiling and jet impingement boiling of liquid nitrogen at the surface of a silicon chip by varying the dewar pressure while maintaining the bath temperature constant at about 78 K. Subcooling levels of up to 10 K could be easily reached by pressurizing the liquid nitrogen bath with helium gas. Convective and boiling impingement cooling of up to 80 W/cm 3 from a silicon chip has been measured for a submerged subcooled liquid nitrogen jet
  • Keywords
    boiling; convection; cooling; cryogenic electronics; integrated circuit packaging; jets; 78 K; N2; bath temperature; convective cooling; dewar pressure; jet impingement boiling; subcooled liquid nitrogen impingement cooling; subcooled pool boiling; Circuits; Electronics cooling; Heating; Helium; Immersion cooling; Nitrogen; Semiconductor device measurement; Silicon; Temperature; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.477465
  • Filename
    477465
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1145090