Title :
Experimental investigation of subcooled liquid nitrogen impingement cooling of a silicon chip
Author :
Vader, David T. ; Chrysler, Gregory M. ; Chu, Richard C. ; Simons, Robert E.
Author_Institution :
Dept. of Eng., Messiah Coll., Grantham, PA, USA
fDate :
12/1/1995 12:00:00 AM
Abstract :
A technique was developed to facilitate subcooled pool boiling and jet impingement boiling of liquid nitrogen at the surface of a silicon chip by varying the dewar pressure while maintaining the bath temperature constant at about 78 K. Subcooling levels of up to 10 K could be easily reached by pressurizing the liquid nitrogen bath with helium gas. Convective and boiling impingement cooling of up to 80 W/cm 3 from a silicon chip has been measured for a submerged subcooled liquid nitrogen jet
Keywords :
boiling; convection; cooling; cryogenic electronics; integrated circuit packaging; jets; 78 K; N2; bath temperature; convective cooling; dewar pressure; jet impingement boiling; subcooled liquid nitrogen impingement cooling; subcooled pool boiling; Circuits; Electronics cooling; Heating; Helium; Immersion cooling; Nitrogen; Semiconductor device measurement; Silicon; Temperature; Thermal conductivity;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
