DocumentCode
1145100
Title
High performance forced air cooling scheme employing microchannel heat exchangers
Author
Kleiner, Michael B. ; Kühn, Stefan A. ; Haberger, Karl
Author_Institution
Tech. Univ. Munchen, Germany
Volume
18
Issue
4
fYear
1995
fDate
12/1/1995 12:00:00 AM
Firstpage
795
Lastpage
804
Abstract
In this paper, a high performance forced air cooing scheme is theoretically and experimentally investigated which employs microchannel parallel plate-fin heat sinks and tubes to deliver the air to and optionally from the heat sink. The performance of the cooling system is modeled in terms of thermal resistance, pressure drop, and pumping power. Optimizations are performed and design trade-offs discussed. Tubes are observed to have a significant impact on optimum heat sink design as well as operating point. Sample heat sinks with lateral dimensions of 5×5 cm2 and fin lengths of 1.5 and 2.5 cm were fabricated from copper and aluminum foils using a simple assembly process. Fin thicknesses and channel widths of the heat sinks are on the order of 200 and 500 μm, respectively. Thermal resistances as low as 0.2 R/W are measured. Results of the present study are compared to prior works dealing with direct air cooling. The thermal performances achievable using the investigated cooling approach are superior to those attainable using open air cooled heat sinks as well as those employing silicon microcoolers
Keywords
cooling; forced convection; heat exchangers; heat sinks; packaging; thermal resistance; 1.5 cm; 2.5 cm; 200 micron; 500 micron; assembly process; channel widths; fin lengths; forced air cooling scheme; heat tubes; lateral dimensions; microchannel heat exchangers; operating point; parallel plate-fin heat sinks; pressure drop; pumping power; thermal performances; thermal resistance; Aluminum; Assembly; Cooling; Copper; Design optimization; Electrical resistance measurement; Heat sinks; Microchannel; Power system modeling; Thermal resistance;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.477466
Filename
477466
Link To Document