• DocumentCode
    1145100
  • Title

    High performance forced air cooling scheme employing microchannel heat exchangers

  • Author

    Kleiner, Michael B. ; Kühn, Stefan A. ; Haberger, Karl

  • Author_Institution
    Tech. Univ. Munchen, Germany
  • Volume
    18
  • Issue
    4
  • fYear
    1995
  • fDate
    12/1/1995 12:00:00 AM
  • Firstpage
    795
  • Lastpage
    804
  • Abstract
    In this paper, a high performance forced air cooing scheme is theoretically and experimentally investigated which employs microchannel parallel plate-fin heat sinks and tubes to deliver the air to and optionally from the heat sink. The performance of the cooling system is modeled in terms of thermal resistance, pressure drop, and pumping power. Optimizations are performed and design trade-offs discussed. Tubes are observed to have a significant impact on optimum heat sink design as well as operating point. Sample heat sinks with lateral dimensions of 5×5 cm2 and fin lengths of 1.5 and 2.5 cm were fabricated from copper and aluminum foils using a simple assembly process. Fin thicknesses and channel widths of the heat sinks are on the order of 200 and 500 μm, respectively. Thermal resistances as low as 0.2 R/W are measured. Results of the present study are compared to prior works dealing with direct air cooling. The thermal performances achievable using the investigated cooling approach are superior to those attainable using open air cooled heat sinks as well as those employing silicon microcoolers
  • Keywords
    cooling; forced convection; heat exchangers; heat sinks; packaging; thermal resistance; 1.5 cm; 2.5 cm; 200 micron; 500 micron; assembly process; channel widths; fin lengths; forced air cooling scheme; heat tubes; lateral dimensions; microchannel heat exchangers; operating point; parallel plate-fin heat sinks; pressure drop; pumping power; thermal performances; thermal resistance; Aluminum; Assembly; Cooling; Copper; Design optimization; Electrical resistance measurement; Heat sinks; Microchannel; Power system modeling; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.477466
  • Filename
    477466