Title :
Correction to "A Simple Test Chip to Assess Chip and Package Design in the Case of Plastic Assemblin
Author :
Alpern, Peter ; Wicher, V. ; Tilgner, R.
Keywords :
Adhesives; Assembly; Computer aided software engineering; Degradation; Optical films; Optical microscopy; Plastic packaging; Surface cracks; Testing; Thermomechanical processes;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
DOI :
10.1109/TCPMA.1995.477474
