DocumentCode :
1145195
Title :
Inductive properties of high-performance power distribution grids
Author :
Mezhiba, Andrey V. ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Rochester, NY, USA
Volume :
10
Issue :
6
fYear :
2002
Firstpage :
762
Lastpage :
776
Abstract :
The design of high integrity, area efficient power distribution grids has become of practical importance as the portion of on-chip interconnect resources dedicated to power distribution networks in high performance integrated circuits has greatly increased. The inductive characteristics of several types of gridded power distribution networks are described in this paper. The inductance extraction program FastHenry is used to evaluate the inductive properties of grid structured interconnect. In power distribution grids with alternating power and ground lines, the inductance is shown to vary linearly with grid length and inversely linearly with the number of lines in the grid. The inductance is also relatively constant with frequency in these grid structures. These properties permit the efficient estimation of the inductive characteristics of power distribution grids. To optimize the process of allocating on-chip metal resources, inductance/area/resistance tradeoffs in high speed performance distribution grids are explored. Two tradeoff scenarios in power grids with alternating power and ground lines are considered.
Keywords :
VLSI; inductance; integrated circuit design; integrated circuit metallisation; integrated circuit noise; power supply circuits; FastHenry; area efficient power distribution grids; grid length; high speed performance distribution grids; high-performance power distribution grids; inductance/area/resistance tradeoffs; inductive characteristics; on-chip interconnect resources; on-chip metal resources; Circuit noise; Inductance; Integrated circuit interconnections; Network-on-a-chip; Nonhomogeneous media; Power distribution; Power grids; Power systems; Semiconductor device noise; Voltage;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2003.808683
Filename :
1178847
Link To Document :
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