DocumentCode
11453
Title
Numerical analysis of the electric field in and near a bubble located in one dielectric in series with another
Author
Chuang Zeng ; Xiaoquan Zheng
Author_Institution
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
Volume
22
Issue
2
fYear
2015
fDate
Apr-15
Firstpage
747
Lastpage
751
Abstract
Three-dimensional (3-D) numerical analysis was performed to quantify the electric field in and near a bubble located in single dielectric and one of two dielectrics in series, and especially to have an insight into the quantitative characteristics of the influence of gaseous defects on the field when the void locates in a high-permittivity liquid in series with polymer film. The results show that the field in the bubble predicted by onedimensional (1-D) treatment of the defect in single dielectric will be significantly greater (about 30% to 2 times) than that given by 3-D model; and for a bubble in one dielectric of very large permittivity in series with another, the field by 1-D treatment is dramatically (more than an order of magnitude) higher than the 3-D results. These data indicate that the influence in field of gaseous defects on the partial discharges and/or breakdown behavior of liquid and solid dielectrics may be overestimated from ten´s percent to several times, or even more than an order of magnitude when the defects locate in high-permittivity dielectric in series with low-permittivity one.
Keywords
bubbles; dielectric liquids; partial discharges; permittivity; 1D defect treatment; 3D numerical analysis; breakdown behavior; bubbles; electric field; gaseous defects; high-permittivity dielectric; high-permittivity liquid; liquid dielectrics; partial discharges; polymer film; solid dielectrics; Dielectrics; Differential equations; Electric fields; Equations; Mathematical model; Permittivity; Solid modeling; Insulation; bubbles; dielectric materials; electric field; numerical analysis;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2015.7076771
Filename
7076771
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