• DocumentCode
    1146331
  • Title

    Transcalent Silicon Power Rectifier

  • Author

    Kessker, S. W., Jr. ; Mckechnie, R.M.

  • Author_Institution
    RCA Electronic Components Lancaster, Pa.
  • Issue
    6
  • fYear
    1971
  • Firstpage
    1151
  • Lastpage
    1156
  • Abstract
    The transcalent rectifier can dissipate power losses while rectifying 250 amperes; it rectified 60-Hz alternating current at conduction angles of 180°, 120°, and 60°, and at frequencies varying from 200 to 2600 Hz at a conduction angle of 180°. It was surge-current tested to a peak of 6500 amperes, life tested for 4108 hours, and cycle-life tested for 10 867 cycles while rectifying 250 amperes of current. The transcalent rectifier dissipates heat more effectively and at lower junction temperature than conventional rectifiers as heat is transferred isothermally by vaporization of liquid in the heat pipe. Operational characteristics are: a thermal impedance of 0.030 C/W between junction and fins; a thermal impedance of 0.21 C/W between fins and ambient; a junction operating at 1300C; size less than 14 cubic inches; and weight less than 10 ounces.
  • Keywords
    Electronic components; Heat sinks; Heat transfer; Impedance; Life testing; Rectifiers; Semiconductor thin films; Silicon; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Aerospace and Electronic Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9251
  • Type

    jour

  • DOI
    10.1109/TAES.1971.310218
  • Filename
    4103870