DocumentCode :
1146390
Title :
Temperature Analysis of Current Crowded Effect in Power Transistors
Author :
Wang, Paul P.
Author_Institution :
IBM Corporation Systems Development Division Kingston, N. Y. 12401
Issue :
6
fYear :
1971
Firstpage :
1201
Lastpage :
1204
Abstract :
Both uniform temperature distribution and crowded temperature distribution for a large-geometry power transistor are studied. Different concepts are used for calculating these two types of temperature distribution. In the first instance, in order to calculate the uniform temperature distribution, it is assumed that the power is uniformly dissipated over the entire emitter surface. In the second instance, in calculating the crowded temperature distribution, the power dissipation is assumed to be concentrated at the edges of the emitter. The time-dependent diffusion equation is solved to calculate the temperature rises in these two cases.
Keywords :
Boundary conditions; Current density; Differential equations; Insulation; Power dissipation; Power transistors; Region 1; Temperature distribution; Thermal conductivity; Voltage;
fLanguage :
English
Journal_Title :
Aerospace and Electronic Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9251
Type :
jour
DOI :
10.1109/TAES.1971.310224
Filename :
4103876
Link To Document :
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