DocumentCode
1146390
Title
Temperature Analysis of Current Crowded Effect in Power Transistors
Author
Wang, Paul P.
Author_Institution
IBM Corporation Systems Development Division Kingston, N. Y. 12401
Issue
6
fYear
1971
Firstpage
1201
Lastpage
1204
Abstract
Both uniform temperature distribution and crowded temperature distribution for a large-geometry power transistor are studied. Different concepts are used for calculating these two types of temperature distribution. In the first instance, in order to calculate the uniform temperature distribution, it is assumed that the power is uniformly dissipated over the entire emitter surface. In the second instance, in calculating the crowded temperature distribution, the power dissipation is assumed to be concentrated at the edges of the emitter. The time-dependent diffusion equation is solved to calculate the temperature rises in these two cases.
Keywords
Boundary conditions; Current density; Differential equations; Insulation; Power dissipation; Power transistors; Region 1; Temperature distribution; Thermal conductivity; Voltage;
fLanguage
English
Journal_Title
Aerospace and Electronic Systems, IEEE Transactions on
Publisher
ieee
ISSN
0018-9251
Type
jour
DOI
10.1109/TAES.1971.310224
Filename
4103876
Link To Document