• DocumentCode
    1146390
  • Title

    Temperature Analysis of Current Crowded Effect in Power Transistors

  • Author

    Wang, Paul P.

  • Author_Institution
    IBM Corporation Systems Development Division Kingston, N. Y. 12401
  • Issue
    6
  • fYear
    1971
  • Firstpage
    1201
  • Lastpage
    1204
  • Abstract
    Both uniform temperature distribution and crowded temperature distribution for a large-geometry power transistor are studied. Different concepts are used for calculating these two types of temperature distribution. In the first instance, in order to calculate the uniform temperature distribution, it is assumed that the power is uniformly dissipated over the entire emitter surface. In the second instance, in calculating the crowded temperature distribution, the power dissipation is assumed to be concentrated at the edges of the emitter. The time-dependent diffusion equation is solved to calculate the temperature rises in these two cases.
  • Keywords
    Boundary conditions; Current density; Differential equations; Insulation; Power dissipation; Power transistors; Region 1; Temperature distribution; Thermal conductivity; Voltage;
  • fLanguage
    English
  • Journal_Title
    Aerospace and Electronic Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9251
  • Type

    jour

  • DOI
    10.1109/TAES.1971.310224
  • Filename
    4103876