DocumentCode :
114718
Title :
Development of a silicon carbide MEMS capacitive pressure sensor operating at 500 °C
Author :
Marsi, Noraini ; Majlis, Burhanuddin Yeop ; Hamzah, Azrul Azlan ; Abidin, Ummikalsom ; Mohd-Yasin, Faisal
Author_Institution :
Inst. Microeng. & Nanoelectron. (IMEN), Univ. Kebangsaan Malaysia, Bangi, Malaysia
fYear :
2014
fDate :
27-29 Aug. 2014
Firstpage :
52
Lastpage :
55
Abstract :
In this paper, we present development of MEMS capacitive pressure sensor based silicon carbide (3C-SiC) materials. The sensor is made up of four elements: a 3C-SiC diaphragm, silicon substrate, a reliable stainless steel (SS) o-ring and (SS) vacuum clamper as the package. The designed are inherent simplicity and ruggedness of this physical configuration that acceptably performed for extreme environment applications such as in gas turbine engine. This study reported a reliability testing of a prototype package MEMS capacitive pressure sensor verified up to 500 °C through high temperature lab testing. At 500 °C, the reliability test results show that the sensitivity of 0.826 pF/MPa is achieved. Experimentally, sensor nonlinearity of 0.61 % is found with hysteresis of 3.13 %. The maximum temperature coefficient of output change is 0.073 %/°C measured at 5 MPa.
Keywords :
capacitive sensors; electronics packaging; microfabrication; microsensors; pressure sensors; reliability; silicon compounds; temperature measurement; temperature sensors; wide band gap semiconductors; MEMS capacitive pressure sensor; SiC; diaphragm; gas turbine engine; high temperature lab testing; maximum temperature coefficient; o-ring; packaging; pressure 5 MPa; reliability testing; silicon substrate; stainless steel; temperature 500 degC; temperature measurement; vacuum clamper; Fabrication; Micromechanical devices; Silicon; Silicon compounds; Substrates; Temperature measurement; Temperature sensors; MEMS; hysteresis; pressure sensor; sensitivity; silicon carbide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location :
Kuala Lumpur
Type :
conf
DOI :
10.1109/SMELEC.2014.6920793
Filename :
6920793
Link To Document :
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