• DocumentCode
    114723
  • Title

    Top-down fabrication of silicon nanowire sensor using electron beam and optical mixed lithography

  • Author

    Rahman, S.F.A. ; Yusof, Nor Azah ; Hamidon, Mohd Nizar ; Zawawi, R.M. ; Hashim, U.

  • Author_Institution
    Univ. Putra Malaysia, Serdang, Malaysia
  • fYear
    2014
  • fDate
    27-29 Aug. 2014
  • Firstpage
    64
  • Lastpage
    67
  • Abstract
    The realization of reliable nanobiosensor devices requires the improvement of fabrication techniques to form the nanometer-sized structures and patterns, which were used to attach nano materials such as DNA for the device elements. This study demonstrates the sensitivity of silicon nanowires (SiNWs)as a sensing element in sensor application. Starting with silicon on insulator (SOI) material, the SiNWswith <;100nm in width were fabricated using electron beam lithography combined with conventional CMOS process. Different numbers of SiNWs which are single, 10 arrays of nanowires and 20 arrays of nanowires were developed. Subsequently, the two metal electrodes which are designated as source (S) and drain (D) were fabricated on top of individual SiNWs using optical lithography process. Optical and electrical characteristic have been proposed to verify the outcome of the fabricated structures. One major part is to observe the SiNWs optically in order to meet the nano-scale variation by using High Power Microscope (HPM) inspection and Field Emission Scanning Electron Microscope (FESEM) imaging. Finally, the samples will be tested electrically using I-V measurement system. The results show thatdevice with single SiNW with 60nm in width give the highest resistivity value due to surface to volume ratio.
  • Keywords
    CMOS integrated circuits; biosensors; electron beam lithography; elemental semiconductors; field emission electron microscopes; inspection; nanofabrication; nanolithography; nanosensors; nanowires; scanning electron microscopy; silicon; silicon-on-insulator; CMOS process; FESEM imaging; HPM inspection; I-V measurement system; SOI material; Si; electrical characteristic; electron beam lithography; field emission scanning electron microscope; high power microscope; metal electrodes; nano materials; nanometer sized structure; nanoscale variation; nanowire arrays; optical characteristic; optical lithography process; reliable nanobiosensor device; silicon nanowire sensor; silicon on insulator; size 60 nm; top-down fabrication technique; Electrodes; Lithography; Nanobioscience; Nanoscale devices; Silicon; Surface treatment; Wires; electrical characterization; electron beam lithography; silicon nanowires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Type

    conf

  • DOI
    10.1109/SMELEC.2014.6920796
  • Filename
    6920796