DocumentCode :
114734
Title :
Impact of different ground planes of UTBB SOI MOSFETs under the single-gate (SG) and double-gate (DG) operation mode
Author :
Othman, Norazila ; Arshad, M. K. Md ; Hashim, S. N. Sabki U.
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Kangar, Malaysia
fYear :
2014
fDate :
27-29 Aug. 2014
Firstpage :
88
Lastpage :
91
Abstract :
In this work, we investigate the impact of different ground planes of UTBB SOI MOSFETs under the single-gate (SG) and double-gate (DG) operation modes by numerical simulations. Simulations were performed for 10 nm gate length UTBB SOI MOSFET of 7 nm thin body (Tsi) and 10 nm thin buried oxide (TBOX) for Vd = 20 mV and 1.0 V. For DG operation mode, the back-gate (BG) and front-gate (FG) were swept simultaneously from 0 to 1.5 V with 10 mV incremental steps. Results reported are on key device parameters such as the threshold voltage (Vth), drain induced barrier lowering (DIBL), drive current (Ion), subthreshold swing (SS) and transconductance (gm). Ground Plane (GP) - B structure which employed a p+ doping under the channel shows the best results under the DG operation mode in terms of the lowest DIBL and SS. However, it recorded a slightly higher Vth while the results of Ion and gm are comparable with its other GP counterparts.
Keywords :
MOSFET; numerical analysis; silicon-on-insulator; DG operation mode; DIBL; GP-B structure; SG operation mode; SS; UTBB SOI MOSFET; double-gate operation mode; drain induced barrier lowering; drive current; ground planes; key device parameters; numerical simulations; p+ doping; single-gate operation mode; size 10 nm; size 7 nm; subthreshold swing; threshold voltage; transconductance; ultra-thin body and box; voltage 0 V to 1.5 V; Doping; Electric fields; Logic gates; MOSFET; Solids; Substrates; Transconductance; UTBB SOI MOSFETs; double-gate (DG); ground planes; single-gate (SG);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location :
Kuala Lumpur
Type :
conf
DOI :
10.1109/SMELEC.2014.6920802
Filename :
6920802
Link To Document :
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