DocumentCode :
1147450
Title :
A Novel Time-Domain Approach for Extracting Broadband Models of Power Delivery NetworksWith Resonance Effect
Author :
Wang, Chen-Chao ; Kuo, Chih-Wen ; Wu, Sung-Mao ; Cheng, Hung-Hsiang ; Chiu, Chi-Tsung ; Hung, Chih-Pin
Author_Institution :
Electr. Lab., Adv. Semicond. Eng. (ASE), Inc., Kaohsiung, Taiwan
Volume :
32
Issue :
3
fYear :
2009
Firstpage :
636
Lastpage :
643
Abstract :
Resonance noise, or power/ground bounce noise, on the power and ground planes of high-speed circuit packages is one of the main concerns of signal integrity or power integrity issues. A novel time-domain approach is proposed to synthesize the broadband models of the power/ground planes with resonance effect. Using waveforms either from measurements by time-domain reflectrometry or simulations by the finite-difference time-domain method, the time-domain step response of the planes is characterized with a pole-residue representation obtained through the matrix pencil method. Lumped circuit equivalent circuit models are then synthesized through the pole-residue representations. The synthesized model can accurately predict the resonance behavior of power/ground planes over a wide frequency range. These models can be efficiently incorporated into the currently available circuit simulator such as HSPICE for the consideration of power/ground bouncing noise in high-speed circuits. Three cases are tested to demonstrate the validity and broadband accuracy of the proposed approach.
Keywords :
equivalent circuits; finite difference time-domain analysis; high-speed techniques; lumped parameter networks; network synthesis; broadband model; circuit simulator; finite-difference time-domain method; high-speed circuit package; lumped circuit equivalent circuit model; matrix pencil method; pole-residue representation; power delivery network; power integrity; resonance effect; signal integrity; time-domain approach; Finite-difference time-domain (FDTD); matrix pencil (MP); power integrity; time-domain reflectometry (TDR);
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2009.2023510
Filename :
5173509
Link To Document :
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