DocumentCode
114754
Title
Mechanical characteristics of porous silicon membrane for filtration in artificial kidney
Author
Burham, Norhafizah ; Hamzah, Azrul Azlan ; Majlis, Burhanuddin Yeop
Author_Institution
Inst. of Microeng. & Nanoelectron. (IMEN), Univ. Kebangsaan Malaysia, Bangi, Malaysia
fYear
2014
fDate
27-29 Aug. 2014
Firstpage
119
Lastpage
122
Abstract
Silicon is a promising material due to it having reliable and desirable characteristics for making porous silicon membrane. Porous membrane is widely used in various applications especially in bioMEMS, Lab on Chip and MEMS. Normally, porous membrane functions as a part of filtration system that can be integrated with other systems to make a complete device. The porous silicon membrane is simulated using COMSOL 4.3a for mechanical verification. This work compares the simulation result of the silicon membrane design with theoretical calculation. This paper studies the effect of pressure across the silicon membrane based on the deflection and von Mises stress at the centre of silicon membrane. The maximum deflection and von Mises stress of different membrane thickness and pore shapes are compared against various levels of pressure applied on the silicon membrane surface. The 100 nm thin silicon membrane studied was found to be far superior to the 25 nm silicon thin membrane, being able to mechanically withstand the applied pressure up to 7.33 kPa (55 mmHg).
Keywords
artificial organs; biomedical materials; elemental semiconductors; membranes; nanofabrication; nanofiltration; nanomedicine; nanostructured materials; porosity; porous semiconductors; semiconductor growth; silicon; COMSOL 4.3a; artificial kidney filtration; bioMEMS; lab-on-chip; mechanical characteristics; mechanical verification; membrane thickness; pore shapes; porous silicon membrane; pressure 7.33 kPa; pressure effect; silicon membrane design; size 100 nm; thin silicon membrane; von Mises stress; Biomembranes; Filtration; Kidney; Shape; Silicon; Stress; COMSOL ver. 4.3; Deflection; Pores; Silicon Membrane; von Mises Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location
Kuala Lumpur
Type
conf
DOI
10.1109/SMELEC.2014.6920810
Filename
6920810
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