DocumentCode :
114789
Title :
Effect of process parameter variability on the threshold voltage of downscaled 22nm PMOS using taguchi method
Author :
Afifah Maheran, A.H. ; Menon, P. Susthitha ; Shaari, Sahbudin ; Kalaivani, T. ; Ahmad, Ishtiaq ; Noor Faizah, Z.A. ; Apte, Prakash R.
Author_Institution :
Inst. of Microeng. & Nanoelectron. (IMEN), Univ. Kebangsaan Malaysia (UKM), Bangi, Malaysia
fYear :
2014
fDate :
27-29 Aug. 2014
Firstpage :
178
Lastpage :
181
Abstract :
This paper provides the enhancement of 22nm planar PMOS transistor technology through downscaling, design parameter simulation and optimization process. The scaled down device is optimized for its process parameter variability using Taguchi method. The aim is to find the best combination of fabrication parameters in order to achieve the target value of the threshold voltage (Vth). A combination of high permittivity material (high-k) and metal gate is utilized simultaneously in replacing the conventional SiO2/Poly-Si technology. For this, Titanium dioxide (TiO2) was used as the high-k material and tungsten silicide (WSix) was used as the metal gate. The simulation results show that the optimal threshold voltage (Vth) of -0.289 V ± 12.7% is achieved in accordance to the ITRS 2012 specifications. This provides a benchmark towards the fabrication of 22 nm planar PMOS in future work.
Keywords :
MOSFET; Taguchi methods; high-k dielectric thin films; permittivity; titanium compounds; tungsten compounds; Taguchi method; TiO2; WSix; design parameter simulation; downscaled PMOS device; fabrication parameters; high permittivity material; high-k material; metal gate; optimal threshold voltage; planar PMOS transistor technology; process parameter variability effect; size 22 nm; High K dielectric materials; Logic gates; MOSFET; Metals; Performance evaluation; Signal to noise ratio; Threshold voltage; 22 nm PMOS; Taguchi Method; high-k/metal gate; scaling down;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location :
Kuala Lumpur
Type :
conf
DOI :
10.1109/SMELEC.2014.6920825
Filename :
6920825
Link To Document :
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