Title :
Parasitic impedance analysis of double bonding wires for high-frequency integrated circuit packaging
Author :
Yun, Sang-Ki ; Lee, Hai-Young
Author_Institution :
Dept. of Electron. Eng., Ajou Univ., Suwon, South Korea
fDate :
9/1/1995 12:00:00 AM
Abstract :
Double bonding wires separated by an internal angle have been characterized in a wide range of frequencies using the Method of Moments with the incorporation of the ohmic resistance. For a 30° internal angle, the calculated total reactance is more than 35% less than that of a single bonding wire due to the negative mutual coupling effect of different current directions. The radiation effect at high frequencies has been observed decreasing the mutual inductance between the angled bonding wires, whereas for parallel bonding wires it greatly increases the mutual inductance
Keywords :
UHF integrated circuits; electric impedance; inductance; integrated circuit interconnections; integrated circuit packaging; method of moments; microwave integrated circuits; millimetre wave integrated circuits; angled bonding wires; double bonding wires; high-frequency IC packaging; high-frequency packaging; integrated circuit packaging; method of moments; mutual inductance; negative mutual coupling effect; ohmic resistance; parallel bonding wires; parasitic impedance analysis; radiation effect; Bonding; Frequency; Impedance; Inductance; Integrated circuit packaging; Message-oriented middleware; Moment methods; Mutual coupling; Radiation effects; Wires;
Journal_Title :
Microwave and Guided Wave Letters, IEEE
