DocumentCode
114796
Title
Fabrication of interdigitated microelectrodes for CuO nanowires I-V measurement
Author
Tiong Teck Yaw ; Chang Fu Dee ; Hamzah, Azrul Azlan ; Majlis, Burhanuddin Yeop ; Salleh, Mustapha Mohd ; Faizal, Mohd ; Rahman, Shah Atiqur
Author_Institution
Inst. of Microengineeering & Nanoelectron., Univ. Kebangsaan Malaysia, Bangi, Malaysia
fYear
2014
fDate
27-29 Aug. 2014
Firstpage
193
Lastpage
196
Abstract
An interdigitated electrode consisted of 50 pairs of 5 μm wide microelectrodes, separated by 5 μm gap has been fabricated using single layer positive photoresist lift-off process. The effect of UV exposure time to electrode width and photoresist overcut angle were optimized for the fabrication of an array interdigitated electrodes. The fabricated interdigitated electrode has been used to measure the electrical properties of thick film and nanowires sample. The Cu2O film and CuO nanowires have been contacted on the aluminium interdigitated electrode through the joule heating technique. Schottky behaviour based I-V characteristics of both Cu2O film and CuO nanowires were observed at room temperature. The formation of Schottky barrier on the sample has been discussed.
Keywords
Schottky barriers; copper compounds; microelectrodes; microfabrication; microsensors; nanofabrication; nanolithography; nanosensors; nanowires; photoresists; thick film sensors; ultraviolet lithography; Cu2O; CuO; Schottky barrier; Schottky behaviour based I-V characteristics; UV exposure time effect; array interdigitated electrodes; electrical property measurement; interdigitated microelectrode fabrication; joule heating technique; nanowire sample; nanowires I-V measurement; photoresist lift-off process; photoresist overcut angle optimization; size 5 mum; thick film; Aluminum; Electrodes; Fabrication; Nanowires; Resists; Scanning electron microscopy; Sensors; Cu2 O; CuO; Interdigitated microelectrodes; Nanowires; Photolithography;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location
Kuala Lumpur
Type
conf
DOI
10.1109/SMELEC.2014.6920829
Filename
6920829
Link To Document