• DocumentCode
    114811
  • Title

    Investigation of the inserted LT-AlGaN interlayer in AlGaN/GaN/AlGaN DH-FET strucutre on Si substrates

  • Author

    Yu-Lin Hsiao ; Chia-Ao Chang ; Chang, Edward Yi

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
  • fYear
    2014
  • fDate
    27-29 Aug. 2014
  • Firstpage
    229
  • Lastpage
    231
  • Abstract
    A novel AlGaN/GaN/AlGaN double-heterostructure field effect transistor (DH-FET) structure with an inserted LT-AlGaN interlayer grown on 150 mm Si substrate has been studied. The DH-FET structure has been characterized by transmission electron microscopy (TEM), secondary ion mass spectrometry (SIMS) and X-ray diffraction (XRD). It is found that the inserted LT-AlGaN interlayer can further induce the compressive stress to compensate the tensile stress. Furthermore, the inserted LT-AlGaN interlayer acts as a dislocation filter to reduce threading dislocation propagation. These results indicate that the inserted LT-AlGaN interlayer plays an important role in the novel DH-FET structure.
  • Keywords
    III-V semiconductors; X-ray diffraction; aluminium compounds; field effect transistors; gallium compounds; secondary ion mass spectroscopy; silicon; transmission electron microscopy; wide band gap semiconductors; AlGaN-GaN-AlGaN; DH-FET structure; SIMS; Si; TEM; X-ray diffraction; XRD; compressive stress; dislocation filter; double-heterostructure field effect transistor structure; inserted LT-aluminium gallium nitride interlayer; secondary ion mass spectrometry; silicon substrates; tensile stress; threading dislocation propagation reduction; transmission electron microscopy; Aluminum gallium nitride; Epitaxial growth; Gallium nitride; Silicon; Substrates; Temperature measurement; X-ray scattering; AlGaN/GaN/AlGaN; Interlayer; double heterostructure FET (DH-FET);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Type

    conf

  • DOI
    10.1109/SMELEC.2014.6920838
  • Filename
    6920838