• DocumentCode
    1148214
  • Title

    Efficient method for the capacitance calculation of circularly symmetric via in multilayered media

  • Author

    Tefiku, Faton ; Yamashita, Eikichi

  • Author_Institution
    Denki Kogyo Co. Ltd., Tokyo, Japan
  • Volume
    5
  • Issue
    9
  • fYear
    1995
  • fDate
    9/1/1995 12:00:00 AM
  • Firstpage
    305
  • Lastpage
    307
  • Abstract
    The equivalent capacitance produced by a circularly symmetric via connecting two microstrip lines on different planes is efficiently calculated by using the rectangular boundary division method. The calculation is carried out considering effects of inhomogeneous media within the line structures as well as the ground conductor thickness on the capacitance produced by a microstrip via. Computational results for various via geometries are presented and compared with presently available data
  • Keywords
    capacitance; conductors (electric); microstrip lines; printed circuits; capacitance calculation; circularly symmetric via; equivalent capacitance; ground conductor thickness; inhomogeneous media; microstrip lines; multilayered media; rectangular boundary division method; via geometries; Boundary conditions; Capacitance; Computational geometry; Conductors; Dielectric substrates; Distributed parameter circuits; Equations; Joining processes; Microstrip; Nonhomogeneous media;
  • fLanguage
    English
  • Journal_Title
    Microwave and Guided Wave Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1051-8207
  • Type

    jour

  • DOI
    10.1109/75.410406
  • Filename
    410406