Title :
Gold nanoplates as sensing material for plasmonic sensor of formic acid
Author :
Binti Morsin, Marlia ; Salleh, Mustapha Mohd ; Umar, Akrajas Ali
Author_Institution :
Fac. of Electr. & Electron. Eng., Univ. Tun Hussien Onn Malaysia, Parit Raja, Malaysia
Abstract :
The gold (Au) nanoplates were grown using seed mediated growth method on the substrate surface. This process consists of two-steps process; seeding and growth of the nanocrystals. The cation polymer namely poly-l-lysine (PLL) was deposited on the substrate to obtain high yield nanoplates before immersed into seed solution. The morphology image of Au nanoplates sample by FESEM shows the yield can be estimated up to 63 % over all area of substrate surface. The optical absorption has two peaks that are associated with transverse (t-SPR) and longitudinal LSPR (l-SPR) respectively. The gold nanoplates sample is tested into formic acid and it was found that their intensities and peak position were changed with the change of surrounding medium. Consequently, using an optical sensor system, variation concentration of formic acid solutions from 1 % to 50 % can be detected. The higher concentration of formic acids will damage the Au nanoplates samples.
Keywords :
chemical sensors; chemical variables measurement; field emission electron microscopy; gold; light absorption; nanosensors; nanostructured materials; optical sensors; plasmonics; polymers; scanning electron microscopy; surface plasmon resonance; Au; FESEM; PLL; cation polymer; formic acid solution concentration; gold nanoplate; image morphology; l-SPR; longitudinal LSPR; nanocrystal; optical absorption; optical sensor system; plasmonic sensor; poly-l-lysine; seed mediated growth method; t-SPR; transverse SPR; Chemicals; Gold; Optical sensors; Plasmons; Substrates; Surface morphology; Formic Acid; Gold nanoplates; Localized surface plasmon resonance (LSPR); Optical Sensor;
Conference_Titel :
Semiconductor Electronics (ICSE), 2014 IEEE International Conference on
Conference_Location :
Kuala Lumpur
DOI :
10.1109/SMELEC.2014.6920854