Title :
A Highly Linear SAW-Less CMOS Receiver Using a Mixer With Embedded Tx Filtering for CDMA
Author :
Kim, Namsoo ; Larson, Lawrence E. ; Aparin, Vladimir
Author_Institution :
Univ. of California at San Diego, La Jolla, CA, USA
Abstract :
An embedded filtering passive (EFP) mixer is used to overcome transmitter power leakage in a receiver without the use of a SAW filter. The receiver IC exhibits more than + 60 dBm of Rx IIP2 , 2.4 dB Rx noise figure, and +77 dB of Triple Beat (TB) with 45 MHz offset transmit leakage at 900 MHz Rx frequency while consuming only 18 mA from a 2.1 V supply. Thanks to the embedded filtering passive mixer, the proposed receiver IC shows an additional 15 dB Tx rejection compared to a conventional receiver. The additional Tx rejection improved the IIP 2 by 10 dB and TB by 30 dB. The complete receiver consists of a differential LNA employing an active post-distortion (APD), I/Q embedded filtering passive mixer, two TIAs for I/Q outputs. The fabricated receiver IC occupies 2.25 mm2 including bonding pads, ESD devices, local oscillator (LO) input buffer, frequency divider, and mixer drivers. The receiver is fabricated using a 0.18 mum CMOS process with 5 metal and 1 poly (5M1P) layer.
Keywords :
CMOS integrated circuits; code division multiple access; low noise amplifiers; mixers (circuits); radio receivers; CMOS process; I-Q embedded filtering passive mixer; active post distortion; code division multiple access; differential LNA; embedded Tx filtering; embedded filtering passive mixer; frequency 45 MHz to 900 MHz; frequency divider; highly linear SAWless CMOS receiver; local oscillator input buffer; mixer drivers; noise figure 2.4 dB; poly(5M1P) layer; receiver IC; size 0.18 mum; transmitter power leakage; voltage 2.1 V; Bonding; Filtering; Frequency; Integrated circuit noise; Multiaccess communication; Noise figure; Nonlinear filters; Passive filters; SAW filters; Transmitters; IIP $_2$; RF CMOS; SAW-less receiver; embedded filtering mixer; linearity; low noise figure; passive mixer; triple beat;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2009.2022921