Strain rate effect on micromechanical properties of SnAgCu solder wire

Dislocation behavior was occurs when an eutectic solder alloy of SnAgCu experiencing different strain at room temperature that require the further analysis in order to relate the physical and microstructure changes towards the mechanical performance of lead free solder. In this study, nanoindentation technique was applied to determine the hardness and modulus on six variant of strain (0.00015 mms^-1, 0.0015 mms^-1, 0.015 mms^-1, 0.15 mms^-1, 1.5 mms^-1 and 15 mms^-1) after tensile test. The P-h curves and the micromechanical parameter namely hardness and residual modulus through nanoindentation test were conducted. The analysis were obtained strain rate sensitivity (m) and stress exponent (n) from dwell time in order to determine the mechanism of grains. The P-h curve result showed the pop-in event at the ranges of 100 nm to 300 nm. The micromechanical properties were show the increment of values at high strain rates. The dominated discontinuity local will occurrence the pop-in event and will activating dislocation distribution.