Title :
Wear of Polysilicon Surface Micromachines Operated in High Vacuum
Author :
Timpe, Shannon J. ; Alsem, Daan Hein ; Hook, D. Adam ; Dugger, Michael T. ; Komvopoulos, Kyriakos
Author_Institution :
Dow Chem. Co., Midland, MI
fDate :
4/1/2009 12:00:00 AM
Abstract :
The evolution of wear at sidewall surfaces of polysilicon microelectromechanical systems was investigated in high vacuum under controlled normal load and sliding speed conditions. The static adhesion force was used as an indicator of the changes in wear characteristics occurring during oscillatory sliding contact. Measurements of the static adhesion force as a function of sliding cycles and scanning electron microscopy observations of micromachines from the same batch process subjected to nominally identical testing conditions revealed two distinctly different tribological patterns, namely, low-adhesion/high-wear behavior and high-adhesion/low-wear behavior. The static adhesion force and wear behavior were found to be in direct correlation with the micromachine operational lifetime. Transmission electron microscopy, selected area diffraction, and energy dispersive X-ray spectroscopy yielded insight into the origin, microstructure, and composition of wear debris and agglomerates adhered onto the sliding surfaces. Results demonstrate a strong dependence of micromachine operational life on the removal of the native oxide film and the organic monolayer coating as well as the formation of agglomerates consisting of organic coating material and wear debris.
Keywords :
adhesion; micromechanical devices; silicon; sliding friction; small electric machines; wear; Si; agglomerates; energy dispersive X-ray spectroscopy; oscillatory sliding contact; polysilicon surface micromachines; scanning electron microscopy; selected area diffraction; static adhesion force; transmission electron microscopy; wear; Adhesion; agglomeration; micromachine lifetime; organic monolayer coating; oscillatory sliding; oxide film; wear behavior; wear debris;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2008.2010851