Title :
Thermal component models for electrothermal network simulation
Author :
Hefner, Allen R. ; Blackburn, David L.
Author_Institution :
Semicond. Electron. Div., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
fDate :
9/1/1994 12:00:00 AM
Abstract :
A procedure is given for developing thermal component models for electrothermal network simulation. In the new electrothermal network simulation methodology, the simulator solves for the temperature distribution within the semiconductor devices, packages, and heat sinks (thermal network) as well as the currents and voltages within the electrical network. The thermal network is represented as an interconnection of compact thermal component models so that the system designer can readily interchange different thermal components and examine different configurations of the thermal network. To facilitate electrothermal network design, the interconnection of the thermal component models is specified by the user in the same way that the interconnection of the electrical network components is specified. The thermal component models are also parameterized in terms of structural and material parameters so that the details of the heat transport physics are transparent to the user. Examples of electrothermal network simulations are given, and the temperature measurement methods used to validate the thermal component models are described
Keywords :
circuit analysis computing; digital simulation; equivalent circuits; heat sinks; packaging; semiconductor device models; temperature distribution; thermal analysis; currents; electrical network; electrothermal network simulation; heat sinks; model interconnection; packages; semiconductor devices; temperature distribution; temperature measurement methods; thermal component models; voltages; Circuit simulation; Electronic packaging thermal management; Electrothermal effects; Heat sinks; Integrated circuit interconnections; Resistance heating; Semiconductor device packaging; Semiconductor devices; Temperature distribution; Voltage;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
