Squeegee deformation study in the stencil printing of solder pastes

Author

Mannan, S.H. ; Ekere, N.N. ; Ismail, I. ; Lo, E.K.

Author_Institution

Dept. of Aeronaut. & Mech. Eng., Salford Univ., UK

Volume

17

Issue

3

fYear

1994

fDate

9/1/1994 12:00:00 AM

Firstpage

470

Lastpage

476

Abstract

We report on the results of an experimental comparison of different types of squeegee blade used in the stencil printing of solder pastes for reflow soldering in SMT, concentrating on paste heights (scooping) and printing defects. We show how our experimental results for squeegee deformation into stencil apertures lead to the construction of a model for squeegee deformation. The model takes into account the force on the squeegee due to solder paste flow and some of the non-Newtonian properties of the solder paste. An explanation is proposed for the differences in paste heights between apertures of different orientations

Keywords

printed circuit manufacture; printing; soldering; surface mount technology; SMT; aperture orientation; nonNewtonian properties; paste heights; printing defects; reflow soldering; solder pastes; squeegee deformation study; stencil printing; Apertures; Blades; Deformable models; Ink; Lead; Printing; Reflow soldering; Semiconductor device modeling; Surface-mount technology; Testing;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.311758

Filename

311758